晶圓研磨GNX200BP晶圓背拋

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晶圓研磨GNX200BP晶圓背拋

——又稱晶圓減薄晶圓拋光(WaferGrinding)



GNX200BP晶圓研磨晶圓背拋概要

GNX200BPWaferGrindingisafullyautomaticcontinuousdownfeedgrindingmachine.Wafersarehandledthroughthemachinebyarobot,andloadunloadarms.Twodifferentstationsareusedforwafercleaningafterthefinalgrindstation.Chuckspeed,grindingwheel,andgrindspindledownfeedratespeedscanbeusedtomanipulategrinderthroughput,surfacefinish,andwheellife.Atwopointinprocessgaugemeasuringsystemcoolswaferthicknessundergrindspindles1and2.Athreepointgrindspindleangleadjustmentmechanismisutilizedforeasilymaintainingwaferprofile(ttv);withtheoptionamotorizedadjustment.Aftercompletionatthegrindstation,thewafertransferstoPolishunitautomatically.Thelocalpolishingunitremovessubsurfacedamageforincreasedwaferdiestrength,andtheabilitytohandlefinalthicknessof50microns.



GNX200BP晶圓研磨晶圓背拋規格

Maximumwafermachiningdiameterofwafer64”or8”

GrindingSpindle: Bearingtype        Airbearing,maximum3600rpm

         Motor            2.2kw,4P,highfrequencymotor

         Rapidfeedspeed      200mmmin

         Grindfeedspeed    1to999μmmin

Grindingwheelsize            ?250mm

IndTable:Numberofworkspindles      3

      WorkspindleBearingtype     MechanicalBearing,orAirBearing(optional)

      SpeedofWorkSpindles    1to600rpm

AutomaticSizingDevice:

    Waferthicknessmeasuringsystem    2pointcontactinprocessgauge

    Waferminimumsettingsize       1μm

    Wafersizedisplayrange    0to1.2mm;tendedrangesoftwareailable

TableCleaningDevice(Grinderside)Water+Ceramicblock

WaferCleaningUnit(Grinderside)    Water+brush,andspinrinsedrystation

NumberofCassettes            2stationsforeachunit(Grinder&Polishunit)

Polishhead                  3KwACservomotorfor10–460rpm

Oscillationspeed               100–8,000mmmin.

HeadLoad                   50–999gcm2

Padsize                200mmO.D.

Polishtablespeed               3KwACservomotorfor50–200rpm

VacuumChuckmaterial             Aluminaceramics(dedicatesizeofwafer)

Chuckcleaning                Brush+Water

Wafercleaning                N.C.W+DIwaterforPolishsurface&Airblowspindry



GNX200BP晶圓研磨晶圓背拋相關產品:

衡鵬供應

GDM300晶圓研磨晶圓減薄晶圓拋光晶圓背拋WaferGrinding



 
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